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Case Packaging & Design

Although the performance of an electronic system is intrinsic to that of its components, the impact ensuing from its packaging should not be underestimated. Indeed, in many applications, it is the case that limits the efficiency of the system.

Zelin assists you in the design of your electronic boxes through numerical simulation. The four main areas of optimization are the mechanical strength, thermal management, electrical insulation and electrical connections.

The applications here include:
• The secure hold of components
• The overall design of the case, the arrangement of the circuit boards and components, and the constituent materials
• Protection of electronic components from external attacks (dust, humidity, solar radiation, etc.)
• The control and optimization of heat dissipation (heat sink, ventilation, etc.)

Success story

Thermal optimization of an electronic unit

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